| Denex #3 |  | Used in laboratory and transducer applications where low creep is desired. |
| EPY-150 | | Room temperature curing exopy packaged in convenient bi-packs. |
| EPY-500 | | Two part, heat curing epoxy adhesive yielding thin glue lines in convenient bi-pak packaging. |
| Epoxylite 813 | | Similar to GA-61 but serviceable to higher temperatures. |
| GC Cement | | For bonding free-filament strain gages on low-TCE materials. |
| H Cement | | For bonding free-filament strain gages on metals. |
| M-Bond 200 | | Most widely used general-purpose adhesive. Easiest to handle. Fast room-temperature curing. |
| M-Bond 300 | | Used only when low-temperature cures are necessary. |
| M-Bond 43-B | | Normally used in transducer gaging. Highly resistant to moisture and chemical attack. Elevated-temperature curing. |
| M-Bond 450 | | High-performance adhesive for transducer applications. |
| M-Bond 600 | | Similar to 610, but faster curing. Can be cured at lower temperature than 610. |
| M-Bond 610 | | Used primarily in applications over wide temperature range. Widely used in transducer gaging. Elevated-temperature curing. |
| M-Bond A-12 | | Adhesive for use in high elongation applications |
| M-Bond AE-10 | | General-purpose adhesive that is highly resistant to moisture and most chemicals. Room-temperature curing. |
| M-Bond AE-15 | | Similar to AE-10. Recommended for more critical applications, including transducer gaging. Elevated-temperature curing. |
| M-Bond GA-2 | | Adhesive primarily used on very rough or irregular surfaces. Cures at room temperature. |
| M-Bond GA-61 | | A 100% solids adhesive used to fill irregular surfaces and anchor leadwires. Elevated temperature cure required. |
| P Adhesive | | Excellent for long term, high temperature use. |
| PBX Cement | | For bonding free-filament strain gages on metals. |
| QA-500 | | Strain gage adhesive |
| RTC Epoxy | | For lab and field applications with post-yield, high-elongation strain gages. |
| Sauereisen DKS-8 | | For bonding free element gages on metals. |
| Series | Description |
