Metallized Plates product information
Metallized Plates <!-- Hybrid -->

 Metallized Plates Datasheet


Check all PDF documents

Documents

Datasheet
Metallized Plates
Application Note
Application Note - Cost-effective High Volume Interconnect Thin Film Substrate Solutions
Application Note - Application of High Conductivity Traces in Thin Film
General Information
General Information - 2009 Review of Thin Film North America Products (Vishay Thin Film, Vishay Electro-Films)
Promotional Material
Capabilities Brochure - Pattern Substrates Using Thin Film Technology: Vishay Electro-Films Application-Specific Pattern Substrates
Instructional Guide - Resistors 101 - Instructional Guide
Product Overview - Ceramic Thin Film LED Package
Product Sheet - Model HDI: High-Density Interconnects
Reference Data
Characteristics & Capabilities - Patterned Substrate Products
Technical Note
Technical Note - Substrate Design Guidelines
Technical Note - Thin Film High-Density Integration (HDI) Design Guidelines
Technical Note - Applications and Design of Plated and Filled Via Circuits
Technical Note - Applications and Design of Plated and Filled Via Circuits
Technical Note - An Introduction to Substrate PIMIC Technology
Combine Checked Documents Into One PDF
Product Support
Technical Questions
Vishay engineers can answer questions about product quality, performance, and specifications.

If you haven't already registered, you must register to submit a request.

* Subject
* Message

Javascript must be enabled